Heat leaves your silicon and never comes back. Our scope starts at the lid of your package and ends at deep space — everything in between is one module, one spec, one supplier.
01
TIM2 interface layer
CUSTOMER LID → OUR PLATE
Hands heat from the customer's GB300 lid into our cold plate. Our spec begins at the lid — the die-to-lid TIM inside the package stays the customer's.
02
Cold plate OUR EDGE
METAL MICROCHANNEL · 117 INTERFACES
A metal microchannel plate on every GPU, CPU, and switch tray — our main differentiator, where thermal resistance is won. Baseline today; an aggressive direct-die / liquid-metal option follows.
03
Pumped loop
PGW · ~2 KG/S · 20 K RISE
A closed, warm propylene-glycol-water loop carries the full load at ~2 kg/s across a 20 K rise. Warm on purpose: rejection scales with T⁴, so every kelvin buys radiator area.
04
Redundant pump
N+1 · HOT-SWAPPABLE · BLDC · ~1–1.5 KW
The only moving part in the system and the #1 failure mode — so it gets the reliability budget: N+1 redundant, hot-swappable brushless pumps.
05
Radiator
TUBE-AND-FIN · ~110 M² · ~345 K
Metal tube-and-fin panels of flight-heritage class, radiating from both faces at ~345 K, flown knife-edge to the sun so the panels see cold sky, not sunlight.
06
Structure
BOOMS · WHIPPLE SHIELD · BRACKETS
Deploy booms, integrated Whipple micrometeoroid shielding, and mounting brackets — scope shared with the bus and settled per customer.